Product Specification Physical State: Solid Packaging Size: 5 L Usage/Application: Soldering Volume: 100gPack Product Description Promotions!! clear Kingbo RMA-218 bga Solder Flux Paste Solder 100g for SMT Reballing The KINGBO RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.It is original.Good formula for BGA reballing / balls worksite can stick the balls much more. 1pcs *Kingbo RMA-218
