Product Function: Crescent Knife: Designed for iPhone A8, A9, A10, A11, and A12 CPU BGA chips. Precision Disassembly Tool: Crooked knife for disassembling and cleaning mobile phone motherboard sealant glue. UV Glue Removal Tool: Ideal for cleaning and removing sealant glue from mobile phone motherboards. Solder Paste Scraper: Perfect for BGA repair and UV glue cleaning on mobile phones. Product Features: Handcrafted Sharpening: Pure manual sharpening and grinding for precise cutting edges. Gold Plating Process: Features a standardized 5UM nickel layer with real gold plating, offering excellent oxidation and corrosion resistance. Premium 4A Material: Made from 0.1mm imported AAAA-grade steel, known for its softness, toughness, heat resistance, and wear resistance. Non-Slip Design: 8mm diameter handle with fine lines for a comfortable, ergonomic grip. Double Handle Construction: Crafted from 0.1mm imported AAAA steel, ensuring durability, heat resistance, and wear resistance.
